Description
Configuration: 3 Phase Bridge
Dimensions: 140 x 72 x 17mm
Mounting Type: PCB Mount
Maximum Power Dissipation: 790 W
Maximum Continuous Collector Current: 250 A
Maximum Collector Emitter Voltage: 650 V
Height: 17mm
Width: 72mm
Length: 140mm
Maximum Gate Emitter Voltage: ±20V
Package Type: HYBRID1
Minimum Operating Temperature: -40 °C
Switching Speed: 1MHz Channel Type: N Maximum Operating Temperature: +150 °C Pin Count: 25 Transistor Configuration: 3 Phase
This is HYBRID1 3 Phase Bridge IGBT Module 250 A max 650 V PCB Mount manufactured by Infineon. The manufacturer part number is FS200R07A1E3BOSA1. The product is available in 3 phase bridge configuration. The given dimensions of the product include 140 x 72 x 17mm. The product is available in pcb mount configuration. Provides up to 790 w maximum power dissipation. The product has a maximum 250 a continuous collector current . Whereas features a 650 v of collector emitter voltage (max). In addition, the height is 17mm. Furthermore, the product is 72mm wide. Its accurate length is 140mm. It offers a maximum ±20v gate emitter voltage . The package is a sort of hybrid1. Whereas, the minimum operating temperature of the product is -40 °c. It has about 1mhz switching speed . The product is available in [Cannel Type] channel. It has a maximum operating temperature of +150 °c. It contains 25 pins. The product offers 3 phase transistor configuration.
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