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Seeit ADA-TQFP32, Straight SMT IC Socket Adapter, 32 Pin Female DIP to 28 Pin Female TQFP

Original price was: £172,06.Current price is: £51,62.

SKU: ET13818275 Category: Tag:

Description

End 1 Type: DIP

End 1 Number of Contacts: 32

Mounting Type: Surface Mount

End 2: 28 Pin Female TQFP

End 1 Gender: Female

Body Orientation: Straight

End 1: 32 Pin Female DIP

End 2 Gender: Female

End 2 Number of Contacts: 28

End 2 Type: TQFP

The Seeit ADA-TQFP32 is an innovative socket adapter designed to facilitate seamless interfacing between two common types of integrated circuit (IC) packages: the Thin Quad Flat Package (TQFP) and the Dual In-line Package (DIP). This adapter explicitly converts a 28-pin TQFP to a 32-pin DIP format.

Crafted with precision, the Seeit ADA-TQFP32 boasts a robust and compact design. It features a 32-pin female DIP connector on one end and a 28-pin female TQFP socket on the other. The adapter is made to align with standard soldering and mounting practices, ensuring it can be easily integrated into existing setups without the need for special tools or processes.

The Seeit ADA-TQFP32, Straight SMT IC Socket Adapter, 32 Pin Female DIP to 28 Pin Female TQFP: Unique Features and Benefits

  • Allows for quick and easy conversion between TQFP and DIP packages.
  • Compatible with a wide range of TQFP chips, making it a versatile tool for various applications.
  • Its compact design saves valuable space on the circuit board.
  • Constructed with high-quality materials to ensure a reliable connection and longevity.
  • Reduces the need for expensive re-designing of PCBs to accommodate different IC packages.

Application Potential of the Socket Adapter

The Seeit ADA-TQFP32 adapter is a practical, reliable, and cost-effective solution for interfacing between TQFP and DIP IC packages, suitable for a wide range of applications, such as:

  • Prototyping and Testing: Ideal for electronics enthusiasts and professionals who need to test TQFP ICs on DIP-centric boards.
  • Educational Use: Useful in educational settings for teaching about different IC packaging types and their interoperability.
  • Repair and Maintenance: Handy for repair technicians who encounter various IC packages in their work.
  • Product Development: Assists in the development phase of electronic products, allowing for easy testing and iteration with different IC types.

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